Advanced PCB Design & Layout Services
Industry-leading PCB design services by IPC-certified engineers. From high-speed digital and RF schematic capture to advanced multi-layer layout, we deliver manufacturable designs optimized for performance, reliability, and cost-efficiency.
Key Features
Expert Schematic Design
Precise schematic capture with hierarchical design capabilities, comprehensive part libraries, electrical rule checking (ERC), and detailed design documentation for manufacturability.
Multi-Layer PCB Layout
Advanced PCB layout services for boards up to 24+ layers, including HDI designs with microvias, blind/buried vias, and sophisticated stackups for optimal signal integrity and power distribution.
High-Speed Digital Design
Specialized high-speed PCB design with controlled impedance routing, length matching, differential pair handling, and simulation-driven optimization for signal integrity at frequencies up to multi-GHz.
RF & Mixed-Signal Layout
Expert RF PCB design with proper grounding schemes, impedance matching, RF isolation techniques, and careful component placement for optimal performance in challenging wireless applications.
EMI/EMC Compliance Design
Proactive EMI/EMC design techniques including proper stackup design, controlled return paths, filtering, shielding, and grounding strategies to ensure regulatory compliance.
Advanced DFM Optimization
Comprehensive Design for Manufacturing analysis ensuring cost-effective production with optimized trace widths, proper clearances, testability features, and panelization for assembly efficiency.
Thermal Management Solutions
Specialized thermal design including copper pours, thermal vias, component spacing optimization, and simulation-based verification to manage heat dissipation in high-power applications.
Flex & Rigid-Flex Design
Expert design of flexible and rigid-flex PCBs with careful attention to bend radii, neutral bend axis placement, strain relief, and specialized manufacturing considerations.
Our PCB Design Process
Design Capabilities
High-density BGA fanouts (0.4mm pitch and below)
Impedance-controlled traces for digital and RF signals
Power integrity analysis and simulation
Design for EMI/EMC compliance and testing
Advanced stackup design and impedance profiling
Deliverables
Manufacturing-ready Gerber/ODB++ files with fabrication notes
BOM and assembly drawings with detailed instructions
DFM/DFA reports and compliance documentation
Source design files in requested CAD format
Signal integrity and design rule check reports